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Model for the dynamic behaviour in magnetic nanoparticles: scripts and experimental data
Model for the dynamic behaviour in magnetic nanoparticles: scripts and experimental data
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contributor
Description
Contains the MATLAB scripts to run the created model and to plot the results of this model (magnetic behaviour) against the measured data (also included). Required:- MATLAB R2021a- Statistics and Machine Learning Toolbox, (Global) Optimalisation, Signal Processing, and Parallel Computing toolbox needed- This .zip file, extracted.
As used in Modelling of Dynamic Behaviour in Magnetic Nanoparticles (https://doi.org/10.3390/nano11123396)
Keywords
License
- CC0-1.0
</>Source code
Not specified
Packages
Reference papers
Mentions
- 1.Author(s): Joaquim Cebolla-Alemany, Marcel Macarulla Martí, Mar Viana, Santiago Gasso-Domingo, Verónica Moreno-Martín, David Bou, Vicenta San FélixPublished in Building and Environment by Elsevier BV in 2025, page: 11316910.1016/j.buildenv.2025.113169
- 2.Author(s): Joaquim Cebolla-Alemany, Marcel Macarulla Martí, Mar Viana, Santiago Gasso-Domingo, Verónica Moreno-Martín, David Bou, Vicenta San Félix, Rubén D. López-CarreñoPublished in Building Simulation by Springer Science and Business Media LLC in 2025, page: 847-86210.1007/s12273-025-1245-7
- 3.Author(s): Marzieh Salimi, Shreyas Kuddannaya, Jeff W. M. BultePublished in Nano Letters by American Chemical Society (ACS) in 2024, page: 15557-1556410.1021/acs.nanolett.4c03553
- 4.Author(s): Yanjun Liu, Xin Feng, Sijia Liu, Lei Li, Xing-Yao Huang, Mengjiao He, Cheng-Feng Qin, Hui Hui, Jie TianPublished in IEEE Transactions on Instrumentation and Measurement by Institute of Electrical and Electronics Engineers (IEEE) in 2024, page: 1-1010.1109/tim.2024.3436100
- 5.Author(s): Shaoqi Sun, Shijie Sun, Lijun Xu, Jing ZhongPublished in Measurement Science and Technology by IOP Publishing in 2024, page: 07590310.1088/1361-6501/ad3a8b
- 6.Author(s): Mihaela Osaci, Matteo CacciolaPublished in Multiscale and Multidisciplinary Modeling, Experiments and Design by Springer Science and Business Media LLC in 2023, page: 15-2910.1007/s41939-023-00174-9
- 7.Author(s): Michal Rajňák, Bystrík Dolník, Katarína Paulovičová, Roman Cimbala, Peter Kopčanský, Milan Timko, Kinnari Parekh, R. V. UpadhyayPublished in The Journal of Chemical Physics by AIP Publishing in 202310.1063/5.0151811
- 8.Author(s): Olanrewaju A. Aladesuyi, Oluwatobi S. OluwafemiPublished in Nano-Structures & Nano-Objects by Elsevier BV in 2023, page: 10105310.1016/j.nanoso.2023.101053
- 9.Author(s): Thinh Q. Bui, Mark-Alexander Henn, Weston L. Tew, Megan A. Catterton, Solomon I. WoodsPublished in Scientific Reports by Springer Science and Business Media LLC in 202310.1038/s41598-023-42620-1
- 10.Author(s): Aleksey A. Nikitin, Anna V. Ivanova, Alevtina S. Semkina, Polina A. Lazareva, Maxim A. AbakumovPublished in International Journal of Molecular Sciences by MDPI AG in 2022, page: 1113410.3390/ijms231911134
- 11.Author(s): Gabriele Barrera, Paolo Allia, Paola TibertoPublished in Physical Review Applied by American Physical Society (APS) in 202210.1103/physrevapplied.18.024077
- 1.Author(s): Shaomeng Yang, Kyohei Okubo, Yoshitaka KitamotoPublished by Elsevier BV in 202510.2139/ssrn.5102423
- 2.Author(s): Quincy Huynh, Owen Doyle, Kelvin Guo, Arvind Swamynathan, Leo Huang, Justin Garlepp, Nessia Dambal, Jacob Bryan, Syahrul Ramdani, Chinmoy Saayujya, Barry KL Fung, Yao Lu, Benjamin Fellows, Olivia Sehl, Steven ConollyPublished by Institute of Electrical and Electronics Engineers (IEEE) in 202310.36227/techrxiv.24309607
- 3.Author(s): Quincy Huynh, Owen Doyle, Kelvin Guo, Arvind Swamynathan, Leo Huang, Justin Garlepp, Nessia Dambal, Jacob Bryan, Syahrul Ramdani, Chinmoy Saayujya, Barry KL Fung, Yao Lu, Benjamin Fellows, Olivia Sehl, Steven ConollyPublished by Institute of Electrical and Electronics Engineers (IEEE) in 202310.36227/techrxiv.24309607.v1
- 4.Author(s): Mihaela Osaci, Matteo CacciolaPublished by Research Square Platform LLC in 202310.21203/rs.3.rs-2625923/v1
- 5.Author(s): Quincy Huynh, Owen Doyle, Kelvin Guo, Arvind Swamynathan, Leo Huang, Justin Garlepp, Nessia Dambal, Jacob Bryan, Syahrul Ramdani, Chinmoy Saayujya, Barry KL Fung, Yao Lu, Benjamin Fellows, Olivia Sehl, Steven ConollyPublished by Institute of Electrical and Electronics Engineers (IEEE) in 202310.36227/techrxiv.24309607.v2
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Max Rietberg
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