SIMULINK model for Lifetime Analysis of IGBT Power Modules in Passively Cooled Tidal Turbine Converters
SIMULINK model for Lifetime Analysis of IGBT Power Modules in Passively Cooled Tidal Turbine Converters
Description
The SIMULINK model is meant to estimate the junction temperature thermal cycling in a power electronic converter coupled with a tidal turbine converter. The temperature cycling information is useful for estimating the useful lifetime of the IGBT power modules in the converter. For lifetime value, you need to have a lifetime model separately, which is not provided here. The details about the modeling (incl. lifetime model) can be found in the linked reference.
For confidentiality purposes, data has not been provided, and as such the model cannot be 'run' right away. However, after supplying the missing data the user can make use of the models.
- CC-BY-NC-SA-3.0
Reference papers
Mentions
- 1.Author(s): Duong Minh Bui, Hung Tan Nguyen, Tien Minh NguyenPublished in 2023 International Conference on Electrical, Communication and Computer Engineering (ICECCE) by IEEE in 2023, page: 1-810.1109/icecce61019.2023.10442789
- 2.Author(s): Yao Zhao, Zheng Liu, Zhiqiang Wang, Guofeng Li, Bing JiPublished in 2022 IEEE 5th International Electrical and Energy Conference (CIEEC) by IEEE in 2022, page: 4787-479210.1109/cieec54735.2022.9846537
- 1.Author(s): R. Manikandan, R. Raja SinghPublished in IEEE Access by Institute of Electrical and Electronics Engineers (IEEE) in 2024, page: 118587-11860410.1109/access.2024.3443138
- 2.Author(s): Omar Fethi Benaouda, Mohamed Mezaache, Hind Djeghloud, Azzedine BendiabdellahPublished in International Journal of Electrical and Computer Engineering (IJECE) by Institute of Advanced Engineering and Science in 2023, page: 247110.11591/ijece.v13i3.pp2471-2481
- 3.Author(s): Alastair P. Thurlbeck, Yue CaoPublished in IEEE Transactions on Energy Conversion by Institute of Electrical and Electronics Engineers (IEEE) in 2023, page: 1325-133710.1109/tec.2022.3231286
- 4.Author(s): Le Zhang, Jiadan WeiPublished in IEEE Access by Institute of Electrical and Electronics Engineers (IEEE) in 2022, page: 72545-7255610.1109/access.2022.3189999
- 5.Author(s): P. Loganathan, P. SelvamPublished in Microelectronics Reliability by Elsevier BV in 2022, page: 11457610.1016/j.microrel.2022.114576
- 6.Author(s): P. Loganathan, P. SelvamPublished in International Journal of Mathematics and Computers in Simulation by North Atlantic University Union (NAUN) in 2022, page: 67-7510.46300/9102.2022.16.11
- 7.Author(s): Faisal Wani, Udai Shipurkar, Jianning Dong, Henk PolinderPublished in Energies by MDPI AG in 2021, page: 645710.3390/en14206457
- 8.Author(s): Nerubatskyi Volodymyr, Plakhtii Oleksandr, Hordiienko Denys, Khoruzhevskyi HryhoriiPublished in 2020